Silicon Design Package Designer @

At SRI Tech Solutions, a leader in semiconductor innovation based in Santa Clara, California, we're expanding our team to include a skilled Silicon Design Package Designer . Join us on-site to contribute to cutting-edge multi-layer package designs that power next-generation electronics. This full-time role offers a competitive salary of $120,000 per year along with comprehensive benefits including health insurance, paid time off, and a retirement plan. If you are passionate about advancing your career in silicon packaging and want to work with industry-leading Mentor/Siemens and Cadence tools, this opportunity is for you. Key Responsibilities Utilize Mentor/Siemens and Cadence tools, especially Package Layout Automation (PLA), to develop precise silicon package layouts. Design complex multi-layer packages ensuring compliance with substrate manufacturing Design Rules and Assembly Rules . Apply SIPI (Signal Integrity & Power Integrity) rules to optimize package performance and reliability. Implement flip-chip package design concepts to meet advanced semiconductor requirements. Perform point-to-point connections accurately based on provided schematics. Run Design Rule Checks (DRC), diagnose root causes of violations, and correct issues promptly to maintain design integrity. Execute component placement and constraint setup to align with project specifications and timelines. Collaborate with cross-functional teams to ensure design feasibility and manufacturability. What We're Looking For Required: Proven experience in multi-layer silicon package design using Mentor/Siemens and Cadence PLA tools. Strong understanding of substrate manufacturing design and assembly rules. Familiarity with SIPI rules and flip-chip package design concepts. Ability to perform detailed DRC and troubleshoot design issues effectively. Excellent problem-solving skills and attention to detail. Bachelor’s degree in Electrical Engineering, Materials Science, or related field. Preferred: Experience working in semiconductor manufacturing or packaging environments. Knowledge of industry standards and emerging packaging technologies. Strong communication skills and ability to work collaboratively in a fast-paced environment. Desire for continuous learning and career advancement in silicon design. What We Offer Competitive salary of $120,000 per year with performance bonuses. Comprehensive health insurance including medical, dental, and vision coverage. Paid time off and flexible vacation policies to support work-life balance. Robust retirement plan with company matching contributions. Opportunities for professional development and training in advanced silicon packaging techniques. On-site work environment in the heart of Silicon Valley with access to cutting-edge technology. Collaborative culture focused on innovation and career growth. Frequently Asked Questions Is this position remote or on-site? This role is strictly on-site at our Santa Clara, California location to facilitate close collaboration with engineering teams and access to specialized equipment. What level of experience is required? Candidates should have at least 3 years of relevant silicon package design experience, preferably in multi-layer and flip-chip technologies. What tools will I be using daily? You will primarily use Mentor/Siemens and Cadence tools, focusing on Package Layout Automation (PLA) for design and verification. Are there opportunities for career advancement? Yes, SRI Tech Solutions encourages professional growth with ongoing training and advancement opportunities within our engineering teams. What is the application process? After submitting your application, qualified candidates will be contacted for an initial interview, followed by technical assessments and final interviews. Does SRI Tech Solutions provide relocation assistance? Relocation support may be available for exceptional candidates; please inquire during the interview process. For more information on silicon packag