Dedicated engineer with over 8 years in automation, process improvement, and PCB manufacturing. Skilled in machinery installation, quality enhancement, and project management, committed to delivering efficient and reliable production solutions.
Expertise in AC/DC Drives, Servo Drives, Pneumatic Valves, and PLC wiring for automation solutions.
Proven track record in reducing defects, analyzing failure trends, and implementing Kaizen initiatives.
Skilled in PCB assembly, Solder Paste application, AOI & SPI inspection, and automated machine monitoring.
Experience in planning, coordinating, and executing new machinery installations and process upgrades.
Apexinergia Tech solutions
Familiar with AC Drives, Servo Drives AC&DC Motors, Pneumatic Valves & Controllers.. Installation of New Machinery, Wiring of PLC as per Drawings.. Planning of New Projects to complete in meantime.. Jigs fixtures calibration and validation.. Glue machine all process like calibration glue path modification. working with robotics, software, and hardware to streamline processes in manufacturing. Focus on manufacturing lines, PLCs, HMI, robotics, and physical machinery.
Pegatron India PVT LTD
Project Leadership for Quality Improvement & Failure Reduction. Created detailed PowerPoint reports focusing on sustaining and improving SMA (Surface Mount Assembly) and Testing Yields.. Troubleshot DEK Screen Printers, improving print yield and achieving optimal production UPH (Units Per Hour). Applied quality tools such as FMEA, SPC, and led 8D problem-solving initiatives.. Led Kaizen continuous improvement projects and analyzed CPK values during NPI projects.. Conduct root cause analysis (RCCA) to identify underlying issues causing production delays.
Foxconn Hon Hai Mega Development India PVT LTD
Ensured customer satisfaction by monitoring Yield and DPPM.. Analyzed defect rates, identified trends, and implemented corrective actions.. Driven the team to meet individual and collective Key Performance Indicators for productivity, quality, and efficiency.
SSLC
HSC
B.E (ECE)
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TSMT Technology India Pvt Ltd
Applied solder paste onto the PCB and prepared it for component placement.. Monitored the accuracy of automated machines that place components on the PCB.. Conducted both pre-AOI and post-AOI inspections on PCBs.