Silicon Package Design Engineer in Santa Clara, CA
Published on CazVidat SRI Tech Solutions
Join SRI Tech Solutions in Santa Clara as a Silicon Package Design Engineer. Apply multi-layer and flip-chip design, PLA, Cadence, and DRC skills.
Salary
$120,000 per year
Location
Santa Clara, California, United States
Employment type
Full time
Workplace
Not provided
Silicon Package Design Engineer in Santa Clara, CA
$120,000 per year
Job description
SRI Tech Solutions is hiring a Silicon Package Design Engineer for a full-time, on-site role in Santa Clara, California. This position focuses on multi-layer and flip-chip package design, layout automation, and design-rule verification.
Key Responsibilities
- Perform point-to-point connections for silicon package layouts.
- Place components and set up design constraints based on provided schematics.
- Run design rule checks (DRC), identify root causes of violations, and resolve issues.
- Use Mentor/Siemens and Cadence tools, especially Package Layout Automation (PLA).
Qualifications and Technical Skills
- Experience designing multi-layer packages and familiarity with flip-chip package design concepts.
- Understanding of substrate manufacturing design rules and assembly rules.
- Familiarity with SIPI (Signal Integrity and Power Integrity) rules.
- Hands-on experience with Mentor/Siemens and Cadence design tools; PLA experience is especially relevant.
Job Details
- Company: SRI Tech Solutions
- Location: Santa Clara, California, United States
- Work arrangement: On-site; not remote eligible
- Job type: Full-time
- Pay: $120,000 per year
Frequently asked questions
Is this position remote or on-site?
This role is on-site in Santa Clara, California and is not eligible for remote work.
What is the salary for this Silicon Design Package Designer role?
The salary is USD 120,000 per year.
What kind of experience do I need for this job?
You need hands-on experience in multi-layer package design and proficiency with Mentor/Siemens and Cadence tools for Package Layout Automation.
What will my main responsibilities be?
You will perform point-to-point connections within package layouts, run Design Rule Checks, diagnose and resolve design issues, and execute designs based on schematics including component placement and constraint setup.
Are there specific technical skills or knowledge required?
Yes, you should understand substrate manufacturing Design Rules and Assembly Rules, be familiar with SIPI (Signal Integrity & Power Integrity) Rules, and know flip-chip package design concepts.