Silicon Design Package Designer @

Published on CazVidat SRI Tech Solutions

Key Responsibilities & Skills: Tools & Knowledge: Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA). Technical Expertise: Multi-

Verified by CazVid10 months agoOpen until: Oct 24, 2026

Salary

$120,000 per year

Location

Santa Clara, California, United States

Employment type

Full time

Workplace

Not provided

Silicon Design Package Designer @

$120,000 per year

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Job description

Key Responsibilities & Skills: Tools & Knowledge: Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA). Technical Expertise: Multi-layer package design experience. Understanding of substrate manufacturing Design Rules and Assembly Rules. Familiarity with SIPI (Signal Integrity & Power Integrity) Rules. Flip-chip package design concepts. Tasks: Perform point-to-point connections. Run DRC (Design Rule Checks), identify root causes, and fix issues. Execute design based on provided schematics, including component placement and constraint setup.

Frequently asked questions

  • Is this position remote or on-site?

    This role is on-site in Santa Clara, California and is not eligible for remote work.

  • What is the salary for this Silicon Design Package Designer role?

    The salary is USD 120,000 per year.

  • What kind of experience do I need for this job?

    You need hands-on experience in multi-layer package design and proficiency with Mentor/Siemens and Cadence tools for Package Layout Automation.

  • What will my main responsibilities be?

    You will perform point-to-point connections within package layouts, run Design Rule Checks, diagnose and resolve design issues, and execute designs based on schematics including component placement and constraint setup.

  • Are there specific technical skills or knowledge required?

    Yes, you should understand substrate manufacturing Design Rules and Assembly Rules, be familiar with SIPI (Signal Integrity & Power Integrity) Rules, and know flip-chip package design concepts.

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