Silicon Design Package Designer in Santa Clara, CA
Publicado en CazViden SRI Tech Solutions
Apply for Silicon Design Package Designer at SRI Tech Solutions in Santa Clara, CA. Full-time, $120K/year. Expertise in Mentor/Siemens & Cadence tools required.
Salario
USD 120,000 per year
Ubicación
Santa Clara, California, United States
Tipo de empleo
Tiempo completo
Modalidad
No especificado
Silicon Design Package Designer in Santa Clara, CA
USD 120,000 per year
Descripción del empleo
Join SRI Tech Solutions as a Silicon Design Package Designer in Santa Clara, California. We are seeking an experienced professional skilled in multi-layer package design and advanced layout automation tools to enhance our semiconductor packaging projects. Key Responsibilities & Skills: Tools & Knowledge: Proficiency with Mentor/Siemens and Cadence tools, especially for Package Layout Automation (PLA). Technical Expertise: Hands-on experience in multi-layer package design. Strong understanding of substrate manufacturing Design Rules and Assembly Rules . Familiarity with SIPI (Signal Integrity & Power Integrity) Rules . Knowledge of flip-chip package design concepts. Primary Tasks: Perform precise point-to-point connections within package layouts. Run DRC (Design Rule Checks) , diagnose root causes, and resolve design issues efficiently. Execute designs based on provided schematics, including component placement and constraint setup . Position Details: Location: Santa Clara, California, United States (On-site) Employment Type: Full-Time Salary: $120,000 per year Remote Work: Not eligible Apply today to be part of a cutting-edge team driving innovation in silicon package design.
Preguntas frecuentes
Is this position remote or on-site?
This role is on-site in Santa Clara, California and is not eligible for remote work.
What is the salary for this Silicon Design Package Designer role?
The salary is USD 120,000 per year.
What kind of experience do I need for this job?
You need hands-on experience in multi-layer package design and proficiency with Mentor/Siemens and Cadence tools for Package Layout Automation.
What will my main responsibilities be?
You will perform point-to-point connections within package layouts, run Design Rule Checks, diagnose and resolve design issues, and execute designs based on schematics including component placement and constraint setup.
Are there specific technical skills or knowledge required?
Yes, you should understand substrate manufacturing Design Rules and Assembly Rules, be familiar with SIPI (Signal Integrity & Power Integrity) Rules, and know flip-chip package design concepts.